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Erschienen in:

2024 | OriginalPaper | Buchkapitel

Recent Development of Low Damage Laser Microprocessing on Surface and Subsurface Treatment of Silicon for Industrial Applications

verfasst von : XinXin Li, Yingchun Guan

Erschienen in: Proceedings of the 3rd International Conference on Advanced Surface Enhancement (INCASE) 2023

Verlag: Springer Nature Singapore

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Abstract

Silicon is one of the most commonly used semiconductor materials. However, working with silicon presents challenges due to its high brittleness and hardness. Drilling, milling, dicing, and surface treatment require careful handling. Fortunately, laser processing technology offers a solution. With its high energy density and smaller heat-affected zone, laser processing is well-suited for working with silicon materials. This paper reviews the interaction mechanism between laser and silicon material and its applications. The surface and subsurface treatments are introduced. The surface roughness, microstructure, residual stress, and electrical properties of silicon material after laser microprocessing are investigated. Based on the current research status, we summarize some of the challenges that must be overcome to allow a wider application of laser in the new generation of semiconductor materials.

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Titel: Recent Development of Low Damage Laser Microprocessing on Surface and Subsurface Treatment of Silicon for Industrial Applications
verfasst von: XinXin Li
Yingchun Guan
Verlag: Springer Nature Singapore
Buch: Proceedings of the 3rd International Conference on Advanced Surface Enhancement (INCASE) 2023
Print ISBN: 978-981-9986-42-2

Electronic ISBN: 978-981-9986-43-9

Copyright-Jahr: 2024
DOI: https://doi.org/10.1007/978-981-99-8643-9_15

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